A team led of UCLA engineers has developed a new semiconductor that is the most efficient material known for drawing and dissipating waste heat. Since thermal management is the primary obstacle to the optimization of electronic performance, this material has the potential to revolutionize the design of computer processors, other electronics, and even LEDs.
Several years of research, design, and production of materials has resulted in defect-free boron arsenide, which is more than three times faster at conducting heat than currently used materials. Its use will allow heat in an electronic device to be quickly extinguished before it concentrates and damages the device.
Read the article in the UCLA Samueli School of Engineering Newsroom →