Integrating Thermal Management Solutions for Vapor Chambers

In the semiconductor industry, devising thermal management solutions for vapor chambers ensures substrates get the desired coating within an ideal temperature-controlled environment. However, given the complexity of the vapor deposition chamber and the variable performance of connected components under different temperature conditions, it is imperative to follow best practices to avoid thermal failures in the long term. 

Vapor Deposition Chambers

Vapor deposition is an important industrial process in which thin films can be built-in multi-dimensional substrate structures. The films may enhance or improve the substrate material, increase corrosion resistance, and add special electrical/mechanical properties to the substrate suitable for specific engineering applications. Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD) are two widely used vapor deposition techniques among various alternatives. In the PVD technique, the deposition material is heated and gasified inside a vacuum chamber at the bottom to travel up and get deposited on the semiconductor wafers to form thin layers. In the CVD process, the source is already in the vapor phase and is pumped into the chamber from an external source which reacts and causes the thin film to deposit.

These processes are highly sensitive and must be carried out inside a vacuum chamber isolated from external atmospheric conditions and contaminants at very low pressure. It requires careful consideration of materials and equipment to ensure the compatibility of the system. 

Challenges With Thermal Management Solutions for Vapor Chambers  

Before the deposition process begins, it is imperative to remove heat from process equipment or bring the temperature to control. In this regard, the manufacturer can use either heat exchangers or chillers.

Semiconductor fabs can barely bear the thermal failures of chillers as they run with expensive refrigeration subsystems. That’s why most fabs use heat exchangers to control fluid process temperature. For heat exchangers to work efficiently, the temperature of the water supply and the process fluid of the facility should be sufficiently low.

The water supplied for cooling various components of the vapor chamber must adhere to a certain pressure, temperature, and supply resistivity parameters. Certain components of the vapor chamber, such as cathode and module manifolds, are physically sensitive. The water supply flow rate must not exceed requirements to prevent any physical damage to these components. However, interconnected valves and elbows between the vapor chamber and the heat exchanger can introduce a pressure drop in the line. Thus, the supply pressure at the heat exchanger should be greater. That’s where the need for external valves becomes imperative. 

Best Practices for Design Engineers 

Failure to select the best components for controlling fluid parameters or improper installation practices may pose challenges when it comes to thermal management for vapor chambers. Here are some proven field techniques to avoid thermal failures and improve efficiency.  

1. Use High-Purity Valves
ALD-rated (Atomic Layer Deposition) valves are designed to limit heat transfer from the body to the actuator and increase the life of the actuator when the body remains at a high temperature. Limiting the heat transfer is what helps one achieve >1M cycle life.

2. Install Pressure Gauges
Installing pressure gauges before and after the control valve assists you in understanding the accurate fluid flow through the heat exchanger. However, make sure to install them with a coil siphon to prevent thermal damage at high temperatures.

3. Use Ideal Heat Exchanger Tube Plugs
Tube plugs provide longer life to the heat exchanger by sealing the leaky ends with a uniform taper. You can custom order them in different materials such as brass, carbon steel, stainless steel, etc.

4. Choose Right Materials
The choice of the right materials decides the reliability of components associated with thermal management solutions for vapor chambers. For instance, a 316L stainless steel gasket can ensure leak-tight performance up to 537°C, whereas a copper material can safely perform up to 204°C.

Take the help of a fluid engineering expert to gain an understanding of thermal management plans specific to your needs. 

Perform Beyond Thermal Challenges and Achieve Precision with Swagelok

At Swagelok, we understand the need for cleanliness and the most rigorous quality requirement when it comes to deposition processes for semiconductors. Our Northern California facility has a dedicated department for order fulfillment where we focus on high-purity and ultra-high-purity thermal management solutions specifically for vapor chambers. We use several advanced gauging techniques to ensure the complex design geometries meet our strict quality standards to offer reliability at high temperatures. The external dimension of special valves and hoses is evaluated through digital image technology to match tightly defined tolerances. These precise and accurate quality checks help us offer you high-standard thermal management solutions for vapor chambers. Moreover, careful selection of materials for our components and maintaining surface chemistry for high temp environments help our clients minimize process downtime and maximize throughput with ease.    

To find out more about how Swagelok Northern California can help you with selecting the right thermal management applications, contact our team today by calling 510-933-6200.

About Morgan Zealear | Product Engineer, Assembly Services

Morgan holds a Bachelor of Science in Mechanical Engineering from the University of California at Santa Barbara. He is certified in Section IX, Grab Sample Panel Configuration, and Mechanical Efficiency Program Specification (API 682), and he is well versed in B31.3 Process Piping Code. Before joining Swagelok Northern, he was a manufacturing engineer at Sierra Instruments, primarily focused on capillary thermal meters for the semiconductor industry (ASML).